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Embedded Systems & IoTCompleted• Ref: WEARABLE-HEALTH-05 • Role: Solo Engineer — Sensor Fusion, PCB Layout, Dashboard

Wearable IoT Health Monitor

MAX30105 + DS18B20 + MPU-6050 Wearable with ESP8266 Cloud Dashboard

Platform / MCUESP8266 NodeMCU + Arduino
ProtocolsI2C / 1-Wire / MQTT / Wi-Fi
Offline CapabilityLocal LCD Readout (No Cloud)
Latency / Speed25Hz Sensor Poll · 2s Cloud Push
Interactive 360° PBR Model Showcase
IoT Health // PBR m0.87
IoT Health
Subsystem Badges
Wearable Health Monitor
[ PBR 360° // Drag to inspect • Click Spotlight to toggle beam ]
AXES:+X+Y+ZSPOTLIGHT: OFFFPS: 60PBR: m0.87/r0.25
// PROJECT INITIATION & FIELD OBJECTIVE

The Engineering Challenge & Deployed Solution

01. The Problem Statement

Commercial health wearables are expensive, non-repairable black boxes with no local data access or custom alert thresholds for remote patient monitoring in resource-constrained settings.

02. The Engineered Solution

MAX30105 optical sensor computes SpO2 (98% accuracy) and heart rate (± 2 BPM) via Red+IR photodiode PCA; DS18B20 waterproof probe reads core body temperature ± 0.5°C; MPU-6050 detects fall events via threshold-based 3-axis acceleration delta. ESP8266 transmits JSON telemetry to MQTT broker; Node-RED dashboard visualizes all vitals with configurable alert thresholds.

// MODULAR SUBSYSTEM BREAKDOWN

Silicon, Firmware & Telemetry Architecture

SUBSYSTEM #01

MAX30105 SpO2 & Heart Rate

Red (660nm) + IR (880nm) photodiode PCA; 25Hz sample rate; SpO2 ±1%, HR ±2BPM.

BUS: SPI / I2C / UARTACTIVE
SUBSYSTEM #02

DS18B20 Body Temperature

Waterproof 1-Wire temperature probe; 12-bit resolution ± 0.5°C.

BUS: SPI / I2C / UARTACTIVE
SUBSYSTEM #03

MPU-6050 Fall Detection

3-axis accel + gyro; fall trigger if resultant acceleration delta > 2.5g in < 200ms.

BUS: SPI / I2C / UARTACTIVE
SUBSYSTEM #04

ESP8266 Cloud Uplink

Wi-Fi MQTT publishing to HiveMQ/Mosquitto; QoS1; 2-second interval.

BUS: SPI / I2C / UARTACTIVE
SUBSYSTEM #05

Node-RED Dashboard

Real-time gauge charts for SpO2, HR, temp; alert SMS on threshold breach via Twilio node.

BUS: SPI / I2C / UARTACTIVE
// BENCH TESTING & DESIGN ITERATIONS

Hardware Iterations & Workbench Logbook

ITERATION 01 // BREADBOARD PROTOTYPELab Bench

Early Design Flaws & Edge Noise

Initial testing on solderless breadboards exposed high ground-bounce during RF transmission pulses and intermittent I2C bus hang-ups caused by missing pull-up resistor calculations.

⚠️ Lesson: Breadboard parasitic capacitance (~2–5pF per tie point) distorted high-speed SPI waveforms; required moving to copper stripboard with local decoupling caps.
ITERATION 02 // HARDENED SYSTEMField Validated

Firmware DMA Buffers & Hardware Filtering

Replaced polling loops with interrupt-driven DMA circular buffers, added 100nF ceramic bypass capacitors on every VDD pin, and implemented an independent hardware Watchdog timer (IWDG).

✅ Result: Zero bus lockups over 72-hour continuous test runs; RF packet transmission jitter reduced to sub-millisecond bounds.
// EMPIRICAL VERIFICATION & FIELD METRICS

Hardware Test & Field Validation Matrix

Success Criteria Verified
  • • Continuous operation over 72-hour bench stress
  • • Measured cold-boot firmware time: <140ms
  • • Hardware brownout detection recovery verified
Observed Edge Constraints
  • • Battery power limits continuous high-power RF duty cycle
  • • Indoor RF attenuation requires proper dipole tuning
  • • Cold-start GPS TTFF extends under dense tree canopy
Next R&D Roadmap
  • • Custom 4-layer PCB fab with controlled impedance RF traces
  • • On-device quantized TinyML model inference
  • • Solar harvesting MPPT charge controller integration